发明名称 |
Hard-soldering method, e.g. for metallic exhaust catalyst substrate honeycomb, involves pre-cleaning stage, and removes solder grains adhering outside desired soldering boundary |
摘要 |
Before soldering, for which adhesive and solder powder are introduced into the joint, a cleaning stage is performed. Solder grains are removed where they project beyond the soldering boundary defining the desired soldering region (2). The metal assembly is first constructed using smooth, structured metal sheets (9). Channels (10) are bounded by V-sections (11), into which the soldering regions extend.
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申请公布号 |
DE10156456(A1) |
申请公布日期 |
2003.06.12 |
申请号 |
DE20011056456 |
申请日期 |
2001.11.16 |
申请人 |
EMITEC GESELLSCHAFT FUER EMISSIONSTECHNOLOGIE MBH |
发明人 |
ROLLE, ARNDT-UDO;ALTHOEFER, KAIT |
分类号 |
B23K1/00;B23K1/20;B23K35/02;B23K35/14;F01N3/28;(IPC1-7):B23K1/20;B23K35/363;B01J35/04;F01N3/10 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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