发明名称 Solder paste
摘要 A lead-free solder paste comprises an Sn-Zn based lead-free solder powder mixed with a flux. The flux contains at least one aromatic hydroxycarboxylic acid selected from the group consisting of aromatic carboxylic acids having one hydroxyl group in a meta position (such as 3-hydroxy-2-methylbenzoic acid) and aromatic carboxylic acids having at least two hydroxyl groups (such as dihydroxynaphthoic acid or dihydroxybenzoic acid) in an amount of 0.1 - 10.0 mass%. The flux may further include 0.5 - 20 mass% of an aliphatic hydroxy carboxylic acid (such as hydroxyoleic acid).
申请公布号 EP1317991(A2) 申请公布日期 2003.06.11
申请号 EP20020292989 申请日期 2002.12.04
申请人 SENJU METAL INDUSTRY CO., LTD;PANASONIC CORPORATION 发明人 TAGUCHI, TOSHIHIKO;TAKAURA, KUNIHITO;HIRATA, MASAHIKO;YOSHIDA, HISAHIKO;NAGASHIMA, TAKASHI
分类号 B23K35/363;B23K35/02;B23K35/26;B23K35/36;C22C13/00;H05K3/34;(IPC1-7):B23K35/36 主分类号 B23K35/363
代理机构 代理人
主权项
地址