发明名称 VALVE GATE TYPE MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent the properties of a resin from being lowered by preventing the local occurrence of a part excessively high in temperature by reducing the difference in resin temperature in the material passage of a valve device. SOLUTION: A valve pin 36 opening/closing a gate 6 is inserted into the material passage 8 in a valve main body 1. A first heater 9 is installed in the intermediate part in the axial direction of the valve main body 1, and a second heater 42 is embedded in a fixed mold to be close to an engagement surface 24 engaging with a fixed ring 7. The intermediate part in the axial direction of the valve main body 1 is heated by the first heater 9, and the tip part in the axial direction is heated indirectly by the second heater 41. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003165141(A) 申请公布日期 2003.06.10
申请号 JP20010364456 申请日期 2001.11.29
申请人 MITSUBISHI MATERIALS CORP 发明人 KIYONO YOSHIHIRO;HORIKAWA YOSHIHIRO
分类号 B29C45/28;B29C45/73;(IPC1-7):B29C45/28 主分类号 B29C45/28
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