发明名称 MOLD FOR MOLDING RESIN
摘要 PROBLEM TO BE SOLVED: To provide a mold for molding a resin having a high thermal efficiency. SOLUTION: The mold for molding the resin utilizes the reaction heat of a chemical reaction advancing in the mold as a heat source necessary to heat or cool the mold. As the reaction heat of the chemical reaction, a combustion heat (oxidation reaction heat) of a combustible gas can be utilized when the mold is, for example, heated. As the reaction heat of other chemical reaction, the reaction heat of an organic reversible reaction is utilized to heat or cool the mold. Since the mold is heated or cooled by utilizing the reaction heat of these chemical reactions generated in the mold, the mold for molding the resin having the higher thermal efficiency than that of the conventional mold for molding the resin in which the mold is cooled or heated by supplying a heating medium from an external unit into the mold, can be provided. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003165119(A) 申请公布日期 2003.06.10
申请号 JP20010369188 申请日期 2001.12.03
申请人 FUJI PHOTO FILM CO LTD 发明人 SAEKI TATSUHIKO;WATANABE SEIICHI
分类号 B29C33/04;(IPC1-7):B29C33/04 主分类号 B29C33/04
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