METHOD FOR MANUFACTURING MICROWAVE INTEGRATED CIRCUITS

摘要

FIELD: electronic engineering; microwave integrated circuit production. SUBSTANCE: conducting strips of desired layout are formed by scanning substrate surface with laser beam of power P at speed v and covering these strips with protective layer upon their manufacture and formation of their layout picture. Maximum power of laser beam Pmax and minimum scanning speed of laser beam vmin are interrelated by equation Pmax/vmin = cpTbS, where c is specific heat conductivity; p is density; Tb is boiling temperature of metal included in ceramic substrate composition; S is surface area of laser beam. In manufacturing large-scale integrated circuits high resolving power is maintained when forming their layout pattern. EFFECT: facilitated manufacture, reduced labor consumption. 2 cl