发明名称 DISCHARGE PLASMA PROCESSING METHOD AND APPARATUS THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a discharge plasma processing method which can accurately control introduction of a process gas between electrodes, and an apparatus therefor. <P>SOLUTION: The processing method for introducing a raw process gas inbetween a pair of electrodes, of which the opposing surface of at least one electrode is coated with a solid dielectric, and processing a substrate to be treated with the plasma provided by means of applying an electric field inbetween the electrodes, is characterized by introducing the raw process gas between the electrodes, through at least two flow-rate control units arranged in parallel. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003160870(A) 申请公布日期 2003.06.06
申请号 JP20010357854 申请日期 2001.11.22
申请人 SEKISUI CHEM CO LTD 发明人 YAMAKAWA TATSUSABURO;ONO TSUYOSHI;YUASA MOTOKAZU
分类号 H05H1/46;C23C16/455;H01L21/31 主分类号 H05H1/46
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