| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting a chip wherein running efficiency of a production line is improved. SOLUTION: Two mounter devices 12A and 12B are placed between a printing machine 10 and a reflow furnace 11. When chips 2 over the processing power of the single mounter device are mounted on a board 1, the board 1 after printing is serially carried from the mounter device 12A of the former step in the mounter device 12B of the later step. When the chips 2 within the processing power is mounted, the board 1 after printing is carried in parallel in both mounter devices 12A and 12B. COPYRIGHT: (C)2003,JPO
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