| 摘要 |
PROBLEM TO BE SOLVED: To prevent the drying rate of coating liquid (evaporation rate of a solvent) from reducing and to perform vacuum drying treatment having high in-plane uniformity, in a method of vacuum-drying a substrate where coating liquid is applied on its surface. SOLUTION: In the vacuum drying equipment to perform vacuum drying to a semiconductor wafer, for example, the equipment is constituted such that a rectifying plate that is a laminated body of first member having a large temperature conductivity, which is set facing a wafer surface, and second member having a small temperature conductivity, is provided so as to face the wafer with a small gap, and vacuum drying is performed. In this case, although an evaporating solvent component draws heat from the first member, the heat is supplied from the second member to prevent temperature reduction of the surface, and the temperature can be maintained in a uniform state due to heat diffusion inside the member. Accordingly, the reduction of evaporation rate is prevented and vacuum drying treatment of high in-plane uniformity can be performed. Further, the equipment may be constituted such that a temperature adjustment means adjusts the temperature of the rectifying plate. COPYRIGHT: (C)2003,JPO
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