| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To avoid variation in a resistance value, crack or chip of an overcoat, and to improve robustness of side face electrodes and assure high temperature storage/operation, in a manufacturing method of a chip resistor comprising a resistor film 4, upper electrodes 3 and sideface electrodes 8 for both ends of the film 4, and an undercoat 5, middle coat 6 and overcoat 7 for covering the resistor film 4, formed on a chip-type insulating substrate 1. <P>SOLUTION: While the overcoat 7 is formed of a heat-hardening synthetic resin having a hardening temperature set to be 400°C or so, each sideface electrode 8 is formed of a conductive paste including a glass frit whose calcination temperature is set to be 400°C or so. <P>COPYRIGHT: (C)2003,JPO</p> |
