METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND GRINDING MACHINE

摘要

PROBLEM TO BE SOLVED: To remove acicular protrusions generated at the beveled part, or the like, of a wafer at the time of trenching. SOLUTION: Acicular protrusions generated at the beveled part, or the like, of a wafer at the time of trenching are removed by grinding by the use of an abrasive film 2. The abrasive film 2 is pressed against the wafer using an elastic body film 4. COPYRIGHT: (C)2003,JPO