| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of void and unfilled resin. SOLUTION: The manufacturing method of semiconductor devices includes a process for preparing a lead frame having a wiring board where the tip of an inner lead is connected to each wiring of the wiring board; a process for fixing a semiconductor chip onto the wiring board; a process for connecting each electrode of the semiconductor chip to each wiring with a wire; a process for clamping the lead frame to a mold die, injecting resin into a cavity from a gate, at the same time, pushing out air from an air vent positioned at a side opposite to the gate, filling the cavity with resin, and forming a sealed body; and a process for cutting an unnecessary lead frame section for removal. A flat plate section that is extended close to the wiring board and whose root becomes thin is provided at the air vent side of the lead frame, and a sealed body is formed so that the resin injected from the gate obstructs flow in the upper and lower directions of the cavity at the flat section. After that, in the cutting of the unnecessary lead frame, the narrow section of the root of the flat section is cut. COPYRIGHT: (C)2003,JPO |
