| 摘要 |
PROBLEM TO BE SOLVED: To prevent exfoliation between a conductor layer and an interlayer resin insulating layer and cracks in the interlayer resin insulating layer under heat cycle condition and high temperature, high pressure and high humidity condition. SOLUTION: The lattice type conductor layer wherein a roughened layer 5 is formed on a side surface is formed on a substrate of a multilayer printed wiring board, so that cracks which are generated by difference of thermal expansion coefficients of the conductor layer and the interlayer resin insulating layer on an interface of them are restrained. Since the conductor layer is closely in contact with the interlayer resin insulating layer via the roughened layer, exfoliation between the conductor layer and the interlayer resin insulating layer is not generated under heat cycle condition and high temperature, high pressure and high humidity condition. COPYRIGHT: (C)2003,JPO |
