| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for effectively preventing development of particles without lowering the productivity in a sputtering apparatus. <P>SOLUTION: This method for preventing development of particles comprises transporting a member for coating 71, of which the surface consists of a film with lower stress than the film formed with the target 41, into a sputtering chamber 4 with a transporting system for coating, to arrange it therein, after forming thin films on the surface of the substrates 9 predetermined times by sputtering a target 41; sputtering the member by using a sputtering power source 72 for coating, to coat a thin film which has deposited on the inner surface of the sputtering chamber 4 during the film forming treatment, with the material of the member for coating 71; and then sputtering the target 41 before carrying the substrate 9 into the sputtering chamber, to flick and remove the particles of the material of the member for coating 71 which has deposited on the target 41 out, from the target 41. <P>COPYRIGHT: (C)2003,JPO</p> |
