| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To build a power circuit having simple and thin structure and including semiconductor switching elements in a circuit constituent, enhance heat dissipation of the element and allow efficient manufacturing of the circuit constituent. <P>SOLUTION: In the circuit constituent, a plurality of bus bars 11, 12, 14 constituting the power circuit adhere to a surface of a control circuit board 20, and the semiconductor switching elements are implemented on the bus bars. The circuit constituent can be manufactured by using a method in which a metal bus bar constituting plate 10 having connected bus bars adheres to the control circuit board 2, the semiconductor elements are implemented and the bus bars are separated. <P>COPYRIGHT: (C)2003,JPO</p> |
