| 摘要 |
<p>A spool gripper (20) is coupled to any one of flanges (12) provided at both sides of a spool (10) wound with a semiconductor device bonding wire thereon. The spool gripper has an inner diameter portion (22) for receiving a spool holder when the spool is fitted to the spool holder, a coupling portion (24) coupled to the circumference of the flange (12) while bearing a diameter larger than the inner diameter portion (22), and an outer diameter portion (26) with a diameter larger than the coupling portion (24). The worker grips the outer diameter portion (26) to handle the spool (10). The handling of the spool can be made without directly touching the spool. The wire bonding operation is made while the gripper being coupled to the flange. Therefore, it is not needed that the gripper (20) should be decoupled from the flange (12) to make the wire bonding operation. Accordingly, the durability of the gripper and the reliability in the spool holding can be maintained without deterioration while preventing separation of the spool from the gripper. Irrespective of the length of the spool holder or the presence of the spool fixation member, the spool handling unit can be used with any typed spool holder. <IMAGE></p> |
