| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for cutting off small diameter piping used in manufacturing semi-conductors, or the like, such that the cut surface becomes flat, and an after-treatment can be easily carried out because the deformation of the piping near the cut off portion is small. SOLUTION: The apparatus for cutting off the small diameter piping is provided with a blade mounted on a frame via a supporting base, a motor for driving the blade, a piping supporting base which is supported by the frame and is movable in the direction parallel to the blade face by means of the feed screw, and a micrometer for measuring the moved distance of the piping supporting base, which is fixed to the frame, by the axial displacement of a probe brought into contact with the piping supporting base. COPYRIGHT: (C)2003,JPO
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