发明名称 Multilayer wiring substrate having differential signal wires and a general signal wire in different planes
摘要 A multilayer wiring substrate includes differential signal wires placed within a first insulating layer between a first power-supply plane and a first ground plane; and general signal wires placed within a second insulating layer between a second power-supply plane and a second ground plane. In the multilayer wiring substrate, the differential signal wires are placed in a different plane from a plane having each of the general signal wires so that the different plane includes a first area having the differential signal wires, and a second area having one of the second power-supply plane and the second ground plane. The general signal wires are placed in a vertical direction of the second area in a laminated state so that each of the general signal wires is placed between the second power-supply plane and the second ground plane.
申请公布号 US6573600(B2) 申请公布日期 2003.06.03
申请号 US20010817787 申请日期 2001.03.27
申请人 FUJITSU LIMITED 发明人 KIKUCHI ATSUSHI;IIJIMA MAKOTO;IKEMOTO YOSHIHIKO;MORIOKA MUNEHARU;KIMURA YOSHIYUKI
分类号 H01L23/12;H01L23/13;H01L23/498;H05K1/02;H05K3/46;(IPC1-7):G01R19/00 主分类号 H01L23/12
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