发明名称 |
Multilayer wiring substrate having differential signal wires and a general signal wire in different planes |
摘要 |
A multilayer wiring substrate includes differential signal wires placed within a first insulating layer between a first power-supply plane and a first ground plane; and general signal wires placed within a second insulating layer between a second power-supply plane and a second ground plane. In the multilayer wiring substrate, the differential signal wires are placed in a different plane from a plane having each of the general signal wires so that the different plane includes a first area having the differential signal wires, and a second area having one of the second power-supply plane and the second ground plane. The general signal wires are placed in a vertical direction of the second area in a laminated state so that each of the general signal wires is placed between the second power-supply plane and the second ground plane.
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申请公布号 |
US6573600(B2) |
申请公布日期 |
2003.06.03 |
申请号 |
US20010817787 |
申请日期 |
2001.03.27 |
申请人 |
FUJITSU LIMITED |
发明人 |
KIKUCHI ATSUSHI;IIJIMA MAKOTO;IKEMOTO YOSHIHIKO;MORIOKA MUNEHARU;KIMURA YOSHIYUKI |
分类号 |
H01L23/12;H01L23/13;H01L23/498;H05K1/02;H05K3/46;(IPC1-7):G01R19/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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