Soldering flux, soldering paste and soldering method using the same

摘要

Provided are a soldering flux or paste containing an organic substance which has at least two hydroxyl (-OH) groups in a molecule and of which the temperature at which the mass % becomes approximately 0% is not lower than approximately 170 DEG C. and not lower than the solid phase linear temperature of the solder, as measured by thermal gravimetry in which a flow rate of an air or nitrogen (N2) gas atmosphere is 200 ml/min and a rate of temperature rise is 10 DEG C./min, and a soldering method using the same. The soldering flux or paste of the present invention gives good wettability to a matrix to be bonded in a normal temperature profile and in a non-reductive atmosphere without leaving any residue.