METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT DEVICE HAVING MULTI-LAYER CIRCUIT BOARD

摘要

PURPOSE: To provide a method for manufacturing an electronic circuit device using a multi-layer circuit board incorporating a compact and high performance thin film capacitor, in which a high capacity value is realized by a thin film dielectric whose dielectric constant is high, and film quality is satisfactory. CONSTITUTION: An electronic circuit device using a multi-layer circuit board has a thin film capacitor 50 constituted by clamping a thin film dielectric layer 20 between a first electrode 11 and a second electrode 1. The first electrode layer 11 and the thin film dielectric layer 20 are continuously laminated in the same chamber in this order on a flat base board 1, and the first electrode layer 11 is worked so that a first electrode conductor pattern can be formed.