| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a sealing method for a semiconductor accelerometer which prevents a sealing resin from creeping into the inside of a surface cap and which enhances a quality. SOLUTION: A first sealing resin 2a in a quantity capable of closing a gap 1 is coated so as to close the gap 1, and a second sealing resin 2b is coated on the outside peripheral part of the gap 1 on the surface of a sensor chip 10 so as to be sealed. When the resin 2a is first coated, the resin 2a has only the quantity capable of sealing the gap 1, and the resin 2a does not creep into the inside of the surface cap 16. When the resin 2b is coated after the gap has been closed with the resin 2a, the resin 2a closes the gap 1, and the resin 2b does not creep into the inside of the surface cap 16 via the gap 1. As a result, the semiconductor accelerometer can be sealed by preventing the resin 2a and the resin 2b from creeping into the inside of the surface cap 16.</p> |
