| 摘要 |
<p>A multi-chip circuit module on which semiconductor chips are mounted and a circuit pattern, I/O terminals, and the like, for connecting them are formed. An upper layer unit wiring layer is formed on a lower layer unit wiring layer where each unit wiring layer (8-12) has a flattened surface and interlayer connection is made through a via-on-via structure thus forming a multilayer wiring part (2). A semiconductor chip (6) mounted on the multilayer wiring part (2) is polished together with a sealing resin layer (7) and made thin.</p> |
