发明名称 RESIN COMPOSITION CONTAINING SUPERFINE PARTICLE AND ITS MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition-molded product having high transparency, excellent light resistance and a low water absorption at the same time. SOLUTION: The resin composition comprises core/shell type semiconductor superfine particles having a number average particle diameter of 1-50 nm, composed of a core of a semiconductor crystal and a shell of an oxide of at least one element selected from aluminum, silicon, zirconium, tin, and antimony provided on the surface of the core, and has a light transmittance per 1 mm optical path length at the sodium D line wavelength of >=70% and a saturated water absorption, measured under the conditions of 60 deg.C and a relative humidity of 90% in accordance with the ASTM D570 provision, of <=0.4 wt.%.
申请公布号 JP2003155415(A) 申请公布日期 2003.05.30
申请号 JP20010355895 申请日期 2001.11.21
申请人 MITSUBISHI CHEMICALS CORP 发明人 KAWA MANABU;EZAKI SATOSHI
分类号 C08J5/00;B29C43/02;B29C43/56;B29L11/00;C01G9/08;C01G11/02;C08F20/20;C08F20/36;C08F290/06;C08F299/02;C08K9/02;C08K9/04;C08L101/00;(IPC1-7):C08L101/00 主分类号 C08J5/00
代理机构 代理人
主权项
地址