发明名称 Wire bonding apparatus
摘要 A wire bonding apparatus including a capillary, which allows a tip end of a bonding wire to protrude from the bottom, and a discharge electrode, which generates a spark between the electrode and the tip end of the wire by an electrical discharge; and auxiliary electrodes being disposed so as to surround the area between the tip end of the wire and the tip end of the discharge electrode. The end portion of the spark on the wire side is guided onto the axial line of the portion of the wire that protrudes from the capillary by the electric fields from the auxiliary electrodes, and the end portion of the spark on the discharge electrode side is guided onto the axial line of the discharge electrode. Dissociated ions are adsorbed on the auxiliary electrodes, preventing the discharge electrode from being contaminated.
申请公布号 US2003098330(A1) 申请公布日期 2003.05.29
申请号 US20020307021 申请日期 2002.11.27
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 MORITA NAOKI
分类号 H01L21/60;B23K20/00;H01L21/00;(IPC1-7):B23K31/02;B23K37/00;B23K31/00 主分类号 H01L21/60
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