发明名称 |
120 Degree bump placement layout for an integrated circuit power grid |
摘要 |
A 120 degree bump placement layout for an integrated circuit power grid is provided. This layout improves integrated circuit performance and reliability and gives an integrated circuit designer added flexibility and uniformity in designing the integrated circuit. Further, a patterned bump array for a top metal layer of an integrated circuit having a plurality of 120 degree bump placement structures is provided.
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申请公布号 |
US2003098508(A1) |
申请公布日期 |
2003.05.29 |
申请号 |
US20010997844 |
申请日期 |
2001.11.29 |
申请人 |
BOBBA SUDHAKAR;THORP TYLER;LIU DEAN |
发明人 |
BOBBA SUDHAKAR;THORP TYLER;LIU DEAN |
分类号 |
H01L21/60;H01L23/50;(IPC1-7):H01L23/52;H01L23/48;H01L29/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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