HYBRID SUBSTRATE WITH EMBEDDED CAPACITORS AND METHODS OF MANUFACTURE

摘要

To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid substrate. In one embodiment, a ceramic portion of the substrate includes at least one capacitor formed of a high permittivity layer sandwiched between conductive planes. An organic portion of the substrate includes suitable routing and fan-out of power and signal conductors. The organic portion includes a build-up of multiple layers of organic material overlying the ceramic portion. Also described are an electronic system, a data processing system, and various methods of manufacture.