| 摘要 |
The method involves generating image data by optically scanning a wafer (5) using a flat bed scanner (11). The scanning process involves illuminating the wafer with a light of preselected wavelength and detecting the light proceeded from the wafer. The method then evaluates the image data that are transmitted to an image processing unit (15). <??>An Independent claim is also included for a defect analysis system for wafers. |
