| 摘要 |
PURPOSE: A method for removing a smut from an oxidized surface of a heat sink plate for a semiconductor package is provided to obtain a high visual effect, enhance the quality of a product, and maintain an insulating characteristic by removing the smut from the oxidized layer. CONSTITUTION: A heat sink plate for a semiconductor package includes a base metal(10) formed with a copper material. An oxidized layer(20) is formed on a surface of the base metal. The oxidized layer includes a needlelike structure(21) and a granular smut(22). The granular smut is formed on the needlelike structure of the oxidized layer. The granular smut is removed from the needlelike structure of the oxidized layer by injecting sand blaster particles(60) into an exposed region(30) of the heat sink plate(100).
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