发明名称 METHOD FOR FOLDING AND MANUFACTURING COPPER FOIL-CLAD BASE AND INTERMEDIATE MEMBER FOR FOLDING COPPER FOIL- CLAD BASE USED THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a method for folding and manufacturing a copper foil-clad base capable of avoiding the damage of a copper foil in handling during conveying and press bonding of the copper foil of the copper foil-clad base having an extremely thin copper foil (6 to 1μm) and an extremely thin base, and to provide an intermediate member for folding the copper foil-clad base used therefor. SOLUTION: The method for folding and manufacturing the copper foil-clad base comprises the steps of forming copper films on one surfaces of flat plate- like carrier plates as two media, then coating to form a prepreg layer for constituting the base to manufacture the intermediate member for folding the copper foil-clad base, opposing the surfaces having the prepreg layer to the intermediate member for folding the two copper foil-clad bases, regulating a pressure by heating, thereby connecting the prepreg layers on the copper film on the two carrier plates to the base, releasing the copper foils on the two carrier plates from the two carrier plates while holding the base and folding the copper foils on the two carrier plates to form the copper foil-clad base.
申请公布号 JP2003154537(A) 申请公布日期 2003.05.27
申请号 JP20010356448 申请日期 2001.11.21
申请人 PIONEER TECHNOLOGY ENGINEERING CO LTD 发明人 KA KENSHIN
分类号 B32B15/04;B29C43/18;B29K105/06;B29L9/00;B32B15/08;H05K3/00;(IPC1-7):B29C43/18 主分类号 B32B15/04
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