发明名称 |
Pad structure of semiconductor package |
摘要 |
A pad structure for semiconductor package. A printed circuit board with solder lands formed on predetermined locations are provided. First circular pad portions are formed protruding laterally on upper surfaces of the solder lands. Second circular pad portions are formed protruding laterally from other lateral sides of the pads. The leads are secured to the pads of the semiconductor package so that when the first and second circular pad portions are pushed laterally, the circular pad portions do not contact each other, preventing short circuits.
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申请公布号 |
US6570100(B1) |
申请公布日期 |
2003.05.27 |
申请号 |
US19990458037 |
申请日期 |
1999.12.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BO WON-DONG HWANG |
分类号 |
H01L23/48;H05K1/11;H05K3/34;(IPC1-7):H05K1/16 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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