| 摘要 |
A connection assembly is provided to connect a part positioned inside a chamber assembly to a stationary surface. The chamber assembly provides a controlled atmospheric condition therein to isolate semiconductor substrates, a wafer stage device, and the process of making semiconductor substrates from the atmospheric condition so that the resulted substrates have an improved quality and meet certain wafer manufacturing specifications. The connection assembly includes a vibration isolation connection assembly and a bellows assembly. The vibration isolation connection assembly is removably connected to a part positioned in the chamber assembly via a link. The bellows assembly encases the vibration isolation connection assembly to maintain a controlled condition of the chamber assembly. The bellows assembly has a first end removably connected to a panel of the chamber assembly, and a second end connected to a stationary surface. The bellows assembly is compressible exposing the vibration isolation connection assembly when fastening or loosening the vibration isolation connection assembly.
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