| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of boring printed wiring board by which through holes can be bored beautifully through a number of printed wiring boards even when the holes are bored by superimposing the wiring boards upon another and high working position accuracy or plating throwing power can be obtained when the printed wiring boards are bored. SOLUTION: At the time of boring through holes through a plurality of substrates each of which is constituted by bonding metal foil to an insulator in a state where the wiring boards are superimposed upon another in multiple stages, at least one layer composed of a component selected from among a group of a water-soluble lubricant (A), a water-soluble polymer (B), a resin composition (C) containing the water-soluble polymer and a copolymer containing the compound expressed by the generalized formula (1) as a copolymer compound, and a resin composition (D) containing the water-soluble polymer and water-soluble lubricant is arranged on the upper surface of an uppermost board and among boards. (wherein, R and n respectively denote hydrogen or a methyl group and an integer of 10-22).
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