| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated ceramic component which hardly makes troubles such as warp occur regardless of the multilayering and thinning of a ceramic green sheet. SOLUTION: In a laminated ceramic electronic component 40, a dielectric ceramic layer 5 and a wiring pattern layer 6 are laminated alternately, and wiring pattern layers 6a, 6b facing each other across the dielectric ceramic layer 5 are electrically connected by via electrodes 8, 8' passing through the dielectric ceramic layer 5. Both the via electrodes 8, 8' and the wiring pattern layers 6a, 6b are constituted of metal mainly composed of one, or two or more kinds selected from among Ag, Au, Ni, Cu, Pt and Pd. The wiring pattern layers 6a, 6b have compositions wherein inorganic compound particles of average grain diameters of 500 nm or less are dispersed in metallic phases composed of the metal, and in the meantime at least one of the via electrodes 8, 8' positioned between opposing surfaces of the wiring pattern layers connected by the via electrodes 8, 8' is composed of only a metallic phase which does not contain an inorganic compound particle.
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