发明名称 PREPARATION METHOD OF BIPOLAR PLATE USING ELECTRICAL CONDUCTIVE RESIN COMPOSITION
摘要 PURPOSE: A method for preparing a bipolar plate using an electrically conductive resin composition is provided, wherein the bipolar plate shows excellent electrical conductivity, thermal conductivity and formability. CONSTITUTION: The method comprises the steps of extrusion mixing 10-95 wt% of a thermoplastic resin and 5-90 wt% of an electrically conductive material with an electrical conductivity of 10¬-2 ¥Ø/cm2 or less at a barrel temperature of 200-340 deg.C to prepare a thermoplastic resin composition; and preparing a bipolar plate using the resin composition, or further electroplating, evaporation-depositing or coating a metal material onto the prepared bipolar plate. Preferably the composition comprises further 5-40 wt% of at least filler selected from the group consisting of glass fiber; an inorganic filler comprising mica, talc and wollastonite; and a halogenated or nonhalogenated flame retardant.
申请公布号 KR20030041004(A) 申请公布日期 2003.05.23
申请号 KR20010071711 申请日期 2001.11.19
申请人 SHUL, YONG GUN 发明人 HWANG, DEOK GEUN;JU, YEONG HWAN;SHUL, YONG GUN
分类号 H01M8/02 主分类号 H01M8/02
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