METHOD FOR FABRICATING SEMICONDUCTOR CHIP

摘要

PURPOSE: A method for fabricating a semiconductor chip is provided to prevent the semiconductor chip from being damaged by making one side of the semiconductor chip with contact elements coated with a covering compound for forming a protective layer. CONSTITUTION: The contact elements protrudes on one side of the semiconductor chip(30) within the context of wafer level packaging. The chip side is provided with the contact elements being coated with the covering compound(31) for forming the protective layer, from which the protruding contact element projects.