| 摘要 |
PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a composite material preferable as a heat dissipating substrate material for mounting electronic parts of a semiconductor device and the like, which material has a better thermal conductivity, compared with the case of the use of a metal gauaze, and which material is excellent in strength. SOLUTION: A composite material 11 comprises an expand metal 12, and a matrix metal 13 surrounding the expand metal 12. The expand metal 12 is formed with a metal plate having a linear expansion coefficient of 8×10<-6> / deg.C or lower. The expand metal 12 is formed with invar (Fe-Ni alloy containing 36% by weight Ni). For the matrix metal 13 use is made of Cu as a metal having thermal conductivity of 200 W/(m.K). |
