| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin film for semiconductor device, having superior electrical characteristics and stable adhesive force, and also to provide a semiconductor device using the same resin. SOLUTION: This resin for semiconductor device is formed of a coating film which includes silane and a polybenzooxazole precursor or a resin film. Moreover, a semiconductor device is formed of a semiconductor substrate and the resin film for the semiconductor device.
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