METHOD AND APPARATUS FOR INSPECTING WAFER AS WELL AS INSPECTING INFRARED IMAGING UNIT

摘要

PROBLEM TO BE SOLVED: To shorten the time of inspecting a wafer and to improve the inspecting accuracy by accurately bringing the electrode formed on a tester probe in contact with the circuit electrode of an IC chip in a short time. SOLUTION: The method for inspecting the wafer comprises the steps of imaging the image of the circuit pattern on the upper surface of the wafer (3) and the image of the tester probe through the wafer (3) by an infrared camera disposed under the wafer (3) in the case of positioning the tester probe (7) directly above the arbitrary IC chip (2), and relatively moving the probe (7) at the position in which the circuit electrode (5) is superposed on the tester electrode (6) based on the image.