发明名称 |
Method of forming a manifold in a substrate and printhead substructure having the same |
摘要 |
A method of forming a manifold through a substrate of a printhead substructure is disclosed. The substrate has an ink reservoir-facing side and an opposing transducer-supporting side. The transducer-supporting side of the substrate is introduced to an etchant. A laser bean is used to irradiate the etchant contacting side of the substrate. The irradiated areas of the substrate are thereby etched to define a first portion of the manifold therein. A second portion of the manifold is formed, preferably by sand blasting, to connect to the first portion. A printhead substructure that includes a substrate having a manifold formed according to the method is also disclosed.
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申请公布号 |
US2003095166(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20010991167 |
申请日期 |
2001.11.16 |
申请人 |
TAN KEE CHEONG;LIM PEAN;CHNG KIONG CHIN |
发明人 |
TAN KEE CHEONG;LIM PEAN;CHNG KIONG CHIN |
分类号 |
B41J2/05;B41J2/14;B41J2/16;(IPC1-7):B41J2/05 |
主分类号 |
B41J2/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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