发明名称 Method for manufacturing semiconductor integrated circuit device
摘要 The invention provides a method that forms a circuit to achieve a high-speed performance and a circuit to attain a high reliability on one and the same substrate, in a semiconductor integrated circuit device containing MIS transistors in which the gate insulating film is made of a high dielectric constant insulating film. The method removes the high dielectric constant insulating film on the diffusion regions of the MIS transistors in the logic region and I/O region, and forms the silicide layers of a low resistance on the surfaces of the diffusion regions. In the memory region, on the other hand, it does not form the silicide layers on the diffusion regions of the MIS transistors, and covers the diffusion regions with the high dielectric constant insulating film, thereby preventing damages to the semiconductor substrate during forming the spacers, silicide layers, and contact holes.
申请公布号 US2003096501(A1) 申请公布日期 2003.05.22
申请号 US20020281189 申请日期 2002.10.28
申请人 OOTSUKA FUMIO;YAMAMOTO SATOSHI;SAKAI SATOSHI 发明人 OOTSUKA FUMIO;YAMAMOTO SATOSHI;SAKAI SATOSHI
分类号 H01L29/78;H01L21/28;H01L21/285;H01L21/60;H01L21/768;H01L21/8234;H01L21/8238;H01L21/8242;H01L27/088;H01L27/092;H01L27/10;H01L29/51;(IPC1-7):H01L21/302;H01L21/461 主分类号 H01L29/78
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