发明名称 |
Retention mechanism for an electrical assembly |
摘要 |
A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.
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申请公布号 |
US2003096524(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20030335679 |
申请日期 |
2003.01.02 |
申请人 |
LLAPITAN DAVID J.;CROCKER MICHAEL;DAVISON PETER |
发明人 |
LLAPITAN DAVID J.;CROCKER MICHAEL;DAVISON PETER |
分类号 |
H01L23/40;H05K7/14;H05K7/20;(IPC1-7):H01R13/62 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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