发明名称 Retention mechanism for an electrical assembly
摘要 A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.
申请公布号 US2003096524(A1) 申请公布日期 2003.05.22
申请号 US20030335679 申请日期 2003.01.02
申请人 LLAPITAN DAVID J.;CROCKER MICHAEL;DAVISON PETER 发明人 LLAPITAN DAVID J.;CROCKER MICHAEL;DAVISON PETER
分类号 H01L23/40;H05K7/14;H05K7/20;(IPC1-7):H01R13/62 主分类号 H01L23/40
代理机构 代理人
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