Heat hardened resin varnish containing a heat cured resin, an aromatic polysulfone resin and an organic solvent, useful for finishing electrical materials and apparatus e.g. printed circuit boards

摘要

A heat hardened resin varnish of outstanding storage stability containing a heat cured resin (A), an aromatic polysulfone resin (B) and an organic solvent (C) in which curing is continued to the point of mixing components A and B and/or after mixing components A and B. Independent claims are included for: (1) a heat cured resin varnish obtained as above; and (2) a cured product obtained by hardening the heat cured resin varnish.