发明名称 |
Center pad type IC chip with jumpers, method of processing the same and multi chip package |
摘要 |
A center pad type integrated circuit chip and a method of forming the same is presented. The chip comprises an integrated circuit chip having chip pads formed on a center region thereof and a jumper. The jumper includes a buffer layer arranged adjacent to a side of the chip pads and a plurality of jump metal lines formed on the buffer layer. The jump metal lines are spaced apart from each other.
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申请公布号 |
US2003094684(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20020269328 |
申请日期 |
2002.10.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM GU-SUNG;JANG DONG-HYEON |
分类号 |
H01L21/60;H01L23/498;H01L23/50;H01L25/065;(IPC1-7):H01L23/02 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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