| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing electronic parts, having high flame retardancy and high moisture resistance by using neither a halogen compound nor an antimony compound. SOLUTION: The resin composition used consists of a phosphoric ester flame retardant, an inorganic anion exchanger, an epoxy resin, a curing agent and an inorganic filler.
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