| 摘要 |
PROBLEM TO BE SOLVED: To prepare an adhesive film for connecting circuits suppressed in increase of connection resistance by internal stress based on a coefficient of thermal expansion, in peeling of an adhesive and in bending of a chip or a base board. SOLUTION: In the heating adhesive film for electrically connecting electrodes in pressurized direction by heating and pressurizing the mutually facing circuit electrodes, the adhesive contains a reactive resin cured by heating, the adhesive film has 50 MPa-1000 MPa storage elastic modulus at 25 deg.C, the adhesive has >=60 deg.C exothermal initiation temperature measured by DSC (differential scanning calorimetry) and the temperature for finishing 80% of curing reaction of <=60 deg.C.
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