| 摘要 |
<p>A process for producing an electrical component having a plurality of soldered-on plug contacts projecting at a right angle, in particular a semiconductor element arranged on a ceramic board, wherein the plug contacts initially remain joined at one side by an edge strip of the sheet metal band from which they are produced, until the solder join to a substrate is made, whereupon the edge strip is removed, wherein the position of the plug contacts is established by bending the edge of the sheet metal.</p> |
