RESIN COMPOSITION, RESIN-COATED METAL FOIL, AND MULTILAYER PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin composition excellent in dielectric characteristics and cracking resistance, to provide a resin-coated metal foil, and a printed wiring board. SOLUTION: The resin composition is one which forms the insulating layer of a resin-coated metal foil and comprises a benzocyclobutene resin and an acicular inorganic filler. The resin-coated metal foil is one prepared by coating a metal foil with the resin composition. The multilayer printed circuit board is one prepared by laying the resin-coated metal foil on at least either surface of an inner layer circuit board and applying heat and pressure to the assemblage.