ADHESIVE SHEET, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prepare an adhesive sheet working as a dicing tape in a dicing step and working as an adhesive sheet having excellent connecting reliability in a connecting step for connecting semiconductor elements with a support. SOLUTION: The adhesive sheet is a heat-polymerizable and radiation- polymerizable adhesive sheet comprising an adhesive agent layer and a substrate layer and is characterized in that the adhesive agent layer comprises (A) a polyimide resin, (B) an epoxy resin and an epoxy resin-curing agent and (C) a radiation-polymerizable compound, wherein the substrate layer has >40 mN/m surface tension and, before radiation exposure, adhesive strength at the interface between the adhesive agent layer and the substrate layer is >=200 mN/cm.