| 摘要 |
To achieve a lower operating gate voltage for an FET, while avoiding breakdown and similar problems, a high K dielectric such as aluminum or zirconium oxide can be used As deposited, these materials tend to have a high density of trapped charge. The present invention discloses how such charge may be neutralized by impregnating the high K dielectric layer with between about 5 and 10 atomic percent of nitrogen. Several methods for introducing the nitrogen are described. These include diffusion from an overlay of silicon nitride, diffusion from a gas source, remote plasma nitridation, and decoupled plasma nitridation.
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