发明名称 Module card and a method for manufacturing the same
摘要 A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a base board; a chip mounting on a surface of the base board; a golden finger on the board and electrically connecting to the chip; and a packing layer forming on the chip for covering the chip.
申请公布号 US6565008(B2) 申请公布日期 2003.05.20
申请号 US20010018072 申请日期 2001.12.04
申请人 KINGPAK TECHNOLOGY INC. 发明人 HO MON NAN;TU HSIU WEN;FENG KUO FENG;CHIU YUNG SHENG;LIU JOE;YEH NAI HUA;CHEN WEN CHUAN;CHEN ALLIS
分类号 B42D15/10;H01L21/56;H01L23/498;(IPC1-7):G06K19/06 主分类号 B42D15/10
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