发明名称 |
Module card and a method for manufacturing the same |
摘要 |
A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a base board; a chip mounting on a surface of the base board; a golden finger on the board and electrically connecting to the chip; and a packing layer forming on the chip for covering the chip. |
申请公布号 |
US6565008(B2) |
申请公布日期 |
2003.05.20 |
申请号 |
US20010018072 |
申请日期 |
2001.12.04 |
申请人 |
KINGPAK TECHNOLOGY INC. |
发明人 |
HO MON NAN;TU HSIU WEN;FENG KUO FENG;CHIU YUNG SHENG;LIU JOE;YEH NAI HUA;CHEN WEN CHUAN;CHEN ALLIS |
分类号 |
B42D15/10;H01L21/56;H01L23/498;(IPC1-7):G06K19/06 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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