SEMICONDUCTOR PACKAGE TRUNCATION APPARATUS USING CLAMP COVER

摘要

PURPOSE: A semiconductor package truncation apparatus using a clamp cover is provided to reduce manufacturing cost and to prevent the failure of a semiconductor package by using a clamp cover having a groove as a package fixing unit instead of using costly adhesive tape. CONSTITUTION: A strip(1) is exactly fixed on a predetermined position of a lower block(3) by using a strip set-up pin(10) and a through hole(2). A clamp cover(6) having a transverse groove is fixed by a clamp cover set-up pin(11). At this time, the failure of a semiconductor package is prevented while carrying out a truncation process. Preferably, the clamp cover(6) is compressed by clamp arms(8) using cylinders(7) located at both sides of the clamp cover(6). Preferably, a compressing rubber plate(5) is inserted in the clamp cover(6).